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Signal Conditioning

High reliability solutions are designed to meet the most challenging requirements for precision and mission critical applications. Modular, high efficiency subsystems are designed to optimize component and assembly efficiencies across the block diagram.

Custom and semi-custom components and modules utilizing hybrid thick and thin film, chip and wire, and SMT processes with leading edge semiconductor technologies.
Utilizing advanced semiconductor technologies like GaN, LDMOS, Silicon MOSFET, GaAs MESPHET, and GaAs pHEMT, achieving high power and broad bandwidths.
Spectrum Control produces a wide range of Digital Frequency Discriminators (DFDs) and Instantaneous Frequency Measurement receivers (IFMs) tailored to the stringent requirements of today’s state-of-the-art EW receivers.
High reliability, oscillator based microwave assembly solutions using complex rf/microwave techniques.