Multi Chip Modules
Mixed Signal & Power, RF, Microwave & MMW, Optoelectronics, Thin Film & SAW Fab
Spectrum Control designes and manufactures Multi Chip Modules, RF/microwave and hybrid components, RF/microwave, MMW, and microelectronic assemblies for defense, space systems, satellite, high-rel commercial, communications, avionics and ruggedized industrial applications, as well as high temperature, harsh environments. As your full-service partner for hybrid engineering and thermal design expertise, we are able to provide you with high performance Multi Chip Modules using state-of-the-art manufacturing processes coupled with the reliability and superior quality.
- Fully Custom Multi Chip Modules
- Build to Print Multi Chip Assemblies
- Compliant to Class K
- Designed for maximum reliability
- Excellent for aerospace and defense applications
- MIL-PRF-38534 Class H or Class K options on qualified manufacturing line
- Hermetically-sealed multi chip modules
- Typical operating temperatures of -55 to +125 degrees centigrade
- Product available for operating temperatures for 150 to 165 degrees centigrade
- Space Qualified
- Extended life-time at 225°C continuous (Ultra High Temperature)
- Thick film multi-layer interconnects
- Thin film
- Large area thick film interconnects
- Low Temperature Co-fired Ceramic (LTCC)
- Chip and wire assembly
- Monometallic wire bonding
- Full compatibility with SOI* and SiC*
- Hermetic packaging
- SMT assembly (PCBA & ceramic)
- System assemblies & box builds
- Complete electrical measurements over temperature
- Accredited Environmental Test House
High-Reliability Electronics for Harsh Environments
High-reliability thick film hybrids and multi-chip modules (MCMs) are Spectrum Control's core competence. From complex hermetically-sealed multi-chip-modules used in aerospace and defence applications, to high-volume automotive control modules, Spectrum Control's thick-film hybrids and Multi Chip Modules are designed for maximum reliability in the harshest environments.
Spectrum Control has successfully tested its thick-film technology at 200 degrees centigrade and the company is introducing new thick-film systems which are capable of performing at 225 degrees centigrade.